...we're headed to the Great Northwest!
The land of trees, green grass and yes...rain!

Scott has taken a new position with Intel Corp. in Hillsboro, Oregon with the 300mm OHT, or Operational HVM (high volume manufacturing) Team.   Yes, that's a nested acronym--par for the course for Intel.  The 300mm OHT is a partnership between the manufacturing and development arms of Intel to develop the latest semiconductor technology on new, larger 12-inch (300mm) silicon wafers. 

Currently, computer chips are fabricated on 6 or 8-inch silicon wafers.   The move to 12-inch represents more than a 2X increase in available "real estate" or surface area in which to make chips.  In addition to an increase in wafer size, the new technology will shrink the size of transistors down to 0.13µ (micron).   Current technologies use 0.18 and 0.25µ transistors. 

All right, enough techno-crap, the real story is the move.  Scott's last day in Fab 11 is Feb. 18th and he reports in Oregon on the 28th.  The job is called a "Longterm Temporary Assignment" (LTA).  We'll be keeping our house here in NM and renting in Oregon.  The length of the assignment is supposed to be 24 months, but nothing at Intel is that certain.  We would then transfer to the next site that converts to 12-inch (300mm) wafers.

So, sometime during the week of Feb. 20th, we'll hop on a plane and fly to PDX while all our worldly belongings follow behind on a big truck.